深圳金菱通达电子有限公司
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GLPOLY 是热导电材料和热管理解决方案领域的领先企业。在 Goldlink，为电子行业开发高品质的热接口材料和热解决方案是我们的首要任务。
GLPOLY 专注于单一目的 - 发现需求，然后通过奉献和创新开发和交付先进的热解决方案。
产品:
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Shenzhen Goldlink Tongda electronics Co,.Ltd | GLPOLYis a leading enterprise in the field of thermal conductive materials and thermal management solutions.At Goldlink, developing high quality t... |
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XK-P20 | Features Conformable, low hardness Excellent compressible Good electrical insualtion Low strain for delicate components Applicat... |
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XK-P30 | Features High thermalperformance Conformable, low hardness Excellent compressible Good electrical insualtion Low strain for delicate components ... |
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XK-P45 | Features High thermal conductivity 4.5W/mK Conformable, low hardness Good electrical insulation Applications Automotive electronics Digital... |
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XK-P50 | Features High performance Low thermal impedance Good electrical insualtion Easy assembling Applications Automotive electronics Digital disk ... |
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XK-P60 | Features Thermal conductivity 6.0W/mK Low thermal impedance Good electrical insualtion Easeofhandling Applications Automotive electronics Di... |
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XK-P110 | Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electronics... |
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XK-P110 | Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electronics... |
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XK-P80 | Features High thermal conductivity 8.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electroni... |
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XK-S20 | Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1... |
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XK-S20 | Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1... |
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XK-S40 | Features Thermal conductivity 4.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1... |
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XK-S30 | Features Thermal conductivity 3.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1... |
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XK-S25 | Features High performance Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure ... |
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XK-S15 | Features Thermal conductivity 1.5W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1... |
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XK-G32 | Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applica... |
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XK-G80 | Features Thermalconductivity8.0W/mK Wetoutsurface,nopumpout Lowcompressionforce Conformingwithwetout Ultralowstressoncomponent Applications A... |
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XK-G60 | Features Thermalconductivity6.0W/mK Lowthermalimpedance Ultralowcompressionforce Long-termreliability Designforlowstressapplication Applicatio... |
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XK-G50 | Features Thermal conductivity 5.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application App... |
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XK-G40 | Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application App... |
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XK-G20 | Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applic... |
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XK-D20L | Features Thermalconductivity2.0W/(m.K),lowstress Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~175℃,Shortterm... |
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XK-D12 | Features Fillinggapsbetweenheatsourceandheatsink Excellentelectricalinsulation,bondstrength≥13Mpa Applicationtemperature:-45~175℃,Shortterm:25... |
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XK-D30 | Features Thermalconductivity3.0W/(m.K),flammabilityUL94-V0 Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~123℃... |
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PCM XK-C16 | Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical ... |
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XK-GN30 | Features High thermal performance Low thermal resistance Ultra conforming Low stress, non pump-out Applications Automotive electronics Coms... |
